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HOME Company COMPANY INFORMATION Company Information Message from the President Corporate Philosophy Company Profile Offices History Group Companies Products PRODUCTSTECHNOLOGY Products &＃038; Technology List of Products by Application Steel plate related Tinplate Tin Free Steel（Hi-Top） Laminated Steel Sheet（Hi-Pet） Electro-galvanized Steel Sheet（Silver Top） Nickel-plated Steel Sheet（Ni-Top） Cold Rolled Steel Sheet（TOP） Vinyl Chloride Resin Decorative Steel Sheet（VINYTOP） SF : Steel Foil Functional Materials Aluminum substrates for magnetic disks（MD） Functional film for optics（Fine Cast Film） Functional film for container（Fine Cast Film） New Materials DNA Chip Genetic Analysis System Research & Development List of products under development Sustainability SUSTAINABILITY Sustainability Society Procurement List of procured items The chemical substances (group) which Toyo Kohan regulates (The 8 edition) Inquiry --> HOME Company COMPANY INFORMATION Company Information Message from the President Corporate Philosophy Company Profile Offices History Group Companies Products PRODUCTSTECHNOLOGY Products &＃038; Technology List of Products by Application Steel plate related Tinplate Tin Free Steel（Hi-Top） Laminated Steel Sheet（Hi-Pet） Electro-galvanized Steel Sheet（Silver Top） Nickel-plated Steel Sheet（Ni-Top） Cold Rolled Steel Sheet（TOP） Vinyl Chloride Resin Decorative Steel Sheet（VINYTOP） SF : Steel Foil Functional Materials Aluminum substrates for magnetic disks（MD） Functional film for optics（Fine Cast Film） Functional film for container（Fine Cast Film） New Materials DNA Chip Genetic Analysis System Research & Development List of products under development Sustainability SUSTAINABILITY Sustainability Society Procurement List of procured items The chemical substances (group) which Toyo Kohan regulates (The 8 edition) Inquiry --> --> Products menu Products menu Steel plate related Tinplate Tin Free Steel（Hi-Top） Laminated Steel Sheet（Hi-Pet） Electro-galvanized Steel Sheet（Silver Top） Nickel-plated Steel Sheet（Ni-Top） Cold Rolled Steel Sheet（TOP） Vinyl Chloride Resin Decorative Steel Sheet（VINYTOP） SF : Steel Foil Functional Materials Aluminum substrates for magnetic disks（MD） Functional film for optics（Fine Cast Film） Functional film for container（Fine Cast Film） New Materials DNA Chip Genetic Analysis System Research & Development Research &＃038; Development Ultra-thin Steel Foil Electrolytic NiP Plating Pure Iron Foil Resin surface treatment for metal bonding Iron-based metallic foil for current collectors for all solid-state/advanced LIBs Silver Top for Composite Substrates with Excellent Resin Adhesion Flexible Copper-Clad Laminates (FCCL) Non-electrolytic plating resin film Clad Materials（FINE CLAD） HOMEProducts &＃038; TechnologyFlexible Copper-Clad Laminates (FCCL) PRODUCTS Products & Technology／Research and Development Flexible Copper-Clad Laminates (FCCL) LCP base (for subtractive processes) Laminated with non-roughened copper foil and LCP film, FCCL offer smooth interfacing and excellent high-frequency characteristics Provided width: Max. 510 mm Format: Rolls, sheets Composition Low transmission loss Achieving good shape for wiring using subtractive method General properties ItemConditionsNon-roughened copper foil FCCLConductor peel strength (N/mm)18 µm rolled copper foil at room temperature0.6Elongation38%13%Dielectric dissipation factorOpen resonant Fabry–Perot method28GHz0.002Relative dielectric constant3.3Solder heat resistance288°C, 10 secondsNo abnormality The above data are representative values measured by our company, not guaranteed values LCP base (Laminated ultra-thin copper foil with carrier/For fine wiring) Laminated ultra-thin copper foil with carrier and LCP, FCCL applicable to MSAP Carrier copper foil can be peeled off easily and evenly. Provided width: Max. 510 mm Format: Rolls, sheets Composition Ultra-thin copper layer lamination with low roughness Cross section after peeling off carrier copper foilConventional design Rz: 1.3 μm* Cross section after peeling off carrier copper foilLow roughness design Rz: 0.9 μm* Copper foil manufacturer&＃8217;s nominal roughness Achieves fine wiring using MSAP General properties ItemConditionsCopper foil with carrier FCCLConductor peel strength18 µm thickness after platingAt room temperatureJIS C 64811.0 N/mmCross section after peeling off carrier copper foilroom temperature0.03 N/mmDielectric dissipation factorOpen resonant Fabry–Perot method28GHz0.002Relative dielectric constant3.3Solder heat resistance288°C, 10 secondsNo abnormality The above data are representative values measured by our company, not guaranteed values LCP base (Ultra-thin plating/For fine wiring) Ultra-thin copper of 0.1 to 0.3 μm laminated on LCP by non-electrolytic platingFCCL enables fine wiring processing and excels in high-frequency characteristics FCCL enables fine wiring processing and excels in high-frequency characteristics Composition Excellent high-frequency characteristics achieved by interface smoothing Achieves fine wiring using SAP General properties ItemConditionsNon-electrolytic copper plating (FCCL)Conductor peel strength18 µm thickness after platingAt room temperature0.7 N/mm18 µm thickness after platingAfter 168 hours at 150°C0.7 N/mmDielectric dissipation factorOpen resonant Fabry–Perot method28GHz0.002Relative dielectric constant3.3Solder heat resistance260°C, 5 secondsNo abnormality The above data are representative values measured by our company, not guaranteed values Toyo Kohan Co., Ltd. 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